Main features:
- Fast random access to cards and boxes during AI&T
- Dimensional stability, no uncertainty add-up
- Parallelized conduction-cooled thermal architecture
- Ease of integration
- CubeSat Rev13 compliance
Avionics bay:
- High-speed differential interconnections (signal & power integrity)
- High stacking density
- Nano and Micro D-SUB connectors
- Redundant power, CAN and M-LVDS busses (SerDes upon request)
- Trigger and Sync. lines.
Universal payload bay:
- 1.7 U volume for the payload
- Card guide slots only, or
- PC104 stack converter, or
- Highly integrated payloads, or
- Hybrid solution
PC104 stack | Card Slot System |
---|---|
Uses COTS connectors | Uses Nano & Micro D-SUB and Strip space qualified connectors |
Random access to cards: impossible | Facilitates random access to cards during integration and testing |
Shared functions – compromises: | Separated main functions: |
– Geometric size of stack: large uncertainty | – Card guides provide precise geometry |
– Increased structural load on cards and connector | – Connectors and cards: free from structural load |
– Thermal management: cards in series, interdependent | – Thermal management of cards: parallelized, independent |